Flip chip lidded ball grid array (FCLBGA) packaging technology, which is commonly used in high-performance computing ...

Samsung is focusing on substance over speed for its next-gen 2nm process, 'preparing for a 3-4 year long-term competition ...

A thermal management scheme is designed in this paper that can be applied to 51.2 Tbit/s co-packaged optics (CPO), which ...

Bourns’ CRK1225 automotive-grade current sense resistor offers a higher power rating and wider resistance range.

Anomalous Josephson effect appears in a topological insulator “Our work will help us better understand the nature of heat dissipation of qubits that can disrupt and destroy quantum information and how ...

Short Circuit Power Dissipation: This is another component of power consumed in the device. When there is a logical change at the input of a circuit, it may change its output state. During this ...

Heat dissipation is growing problem for telecom service providers, who need reduce operating expenses and meet growing government demands for “green” compliance. Heat dissipation must be approached ...

New research utilizing data from NASA's Parker Solar Probe has provided the first direct evidence of a phenomenon known as ...