The impact of combining electrical and optical test in a single device.

This coupling heavily influences performance and yield. Heat induces mechanical deformation, deformation alters carrier ...

How evolving standards, design-for-test strategies, and automation are shaping efficient production testing for 2.5D and 3D ...

Nevertheless, the economic incentive is growing. Interposers are becoming bigger, more essential, and more costly for many ...

AI changes everything: By 2030, Tseng noted that nearly half of the semiconductor industry’s capital expenditure will be ...

Achieving the CD gratings for future technology nodes requires multi-patterning approaches, such as self-aligned ...

To identify and evaluate candidate materials, process engineers must analyze an enormous amount of data. Bulk properties like ...

Power, performance, and area metrics alone are no longer sufficient to capture the full range of design goals.

One of the defining challenges of advanced packaging lies in maintaining traceability as dies move through multiple ...

Multi-modal sensors generate data that edge AI can turn into actionable insights, provided new devices can be integrated with ...

Loop Driving Simulators: Simplifying Real Component Integration in Simulated Environments” was published by researchers at ...

Systematizing a Decade of Architectural RowHammer Defenses Through the Lens of Streaming Algorithms” was published by ...