Through glass via (TGV) interconnect structure serves an essential part in 3D advanced packaging technology. The Cu/amorphous SiO2 (a-SiO2) heterostructure is an important component in the TGV wafer.

We report on the influence of the areal density of reactive surface sites and the growth temperature on the growth per cycle (GPC) during O2-plasma-assisted atomic layer deposition (ALD) of SiO2 using ...

A popular 2D active material, molybdenum disulfide (MoS2), just got a platinum upgrade at an atomic level. A study led by researchers from the University of Vienna and Vienna University of ...

This Section implements all activities of the IAEA's Water Resources Programme, which promotes and transfers know-how on the use of isotope hydrology as an effective tool for water resources ...

Researchers use circularly polarized light to control the direction of exciton polaritons in 2D semiconductors, enabling new ...

May 16, 2025 — Scientists have decoded the atomic structure of Photosystem I from a 3-billion-year-old cyanobacteria lineage, offering a unique look at early oxygen-producing photosynthesis.