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Imagen del 18 de febrero de 2025 de Jia Xinyu, un estudiante de doctorado de la Universidad de Pekín, mostrando un chip ...

实现超快速的芯片间封装（chip-to-chip assembly）。 为了进一步推动全环绕栅极（GAA）的微缩，英特尔代工展示了硅基 RibbionFET CMOS （互补金属氧化物 ...