Through-silicon-vias (TSVs) are prone to defects during the manufacturing process, which pose yield challenges for three dimensional integrated circuits (3D-ICs). The area per TSV is too great to be ...

3D Printing is a technology which is based on additive manufacturing. This technology has a potential to change the manufacturing industry by manufacturing product in the shortest time period where at ...

Three-dimensional (3D) printing is becoming an increasingly common technique to fabricate scaffolds and devices for tissue engineering applications. This is due to the potential of 3D printing to ...