The 10 angstrom node will usher in new architectures, tooling, and materials, forcing a massive change in the way fabs build ...

In this modern era, high-performance computing (HPC) systems have become essential in addressing the increasing complexity of ...

FNU Parshant's research highlights the impact of scalable interconnects and energy-efficient SoC designs in HPC ...

Chipmaker Nvidia (NASDAQ: NVDA) will report financial results for the fourth quarter of fiscal 2025 (which ended in January ...

STMicroelectronics has launched a new data center photonics chip, developed in collaboration with AWS. Dubbed the PIC100, ...

STMicroelectronics is unveiling its next generation of proprietary technologies for higher-performing optical interconnect in ...

In a statement, the company said the funds would be used to further the development of its optical interconnects for AI data centers and high-performance computing systems. The financing will also ...

A parshant of FNU sheds light on advancing in scalable interconnects and low-power System-on-chip, describing how those contribute to the computing performance and energy consumption of future ...

Molex has launched a new line of EMI-filtered interconnects and RF components for aerospace and defense applications.

"These new RF components and EMI-Filtered interconnects extend Molex's legacy of RF excellence while adding significant product breadth and depth for tackling the toughest connectivity challenges," ...