With the EU looking to impose PFAS (per- and polyfluoroalkyl substances) related regulations, the default automotive ...

Regulations like the Advanced Driver Distraction Warning (ADDW) and General Safety Regulation (GSR) are driving the growing importance of in-cabin sensing, particularly driver and occupancy monitoring ...

Emerging Technologies e-Store at IDTechExSoftware-Defined Vehicles, Connected Cars, and AI in Cars 2026-2036: Markets, Trends, and Forecasts IDTechEx's Software-Defined Vehicle (SDV) Market Report ...

This report examines the high-performance computing (HPC) and AI hardware markets. Covering 7 key areas of componentry from AI chips to thermal management, including granular market forecasts from ...

Improvements to battery technology will be critical to the development of various industries, including vehicle ...

IDTechEx has been studying telecommunication technologies for many years and we have just released our latest version of the 6G market research report "6G Market 2023-2043: Technology, Trends, ...

Printed sensors are a rapidly growing technology that offer low-cost processing, flexible thin-film form factor and large area sensing, making them suitable for emerging applications such as the ...

Battery markets for construction, agriculture, and mining vehicles across China, US, Europe, & RoW. Technology benchmarking, performance analysis, beyond Li-ion. 10-year forecasts for battery demand ...

Development of green hydrogen plants will create demand for many materials and components needed to construct electrolyzer stacks. This IDTechEx report discusses the incumbent and future materials as ...

IDTechEx's report "Additives for Li-ion Batteries and PFAS-Free Batteries 2026-2036: Technologies, Players, Forecasts" provides a detailed deep-dive into the fast-evolving additives for Li-ion ...

About IDTechExなぜIDTechExなのか 専門テクノロジーアナリスト 私たちのサービスの鍵は、高度な技術的背景を持ち、各分野で豊富な人脈を持つ専門アナリストが、グローバルレベルで徹底的な一次調査を行うことにあります。これにより、先進技術と既存ソリューションの現在および予測される能力 ...

This report provides a comprehensive overview of thermal challenges in advanced semiconductor packaging (ASP), covering power delivery evaluation for 2.5D and 3D ICs, identification of key thermal ...